ChinaPCBOne is professional Rigid PCB Manufacturer. We can produce Rigid PCB where other cannot, Such as: 48 Layers Rigid PCB, 19OZ Heavy Copper PCB, HDI PCB, and so on.

ChinaPCBOne is continuously innovating the technology improving our Rigid PCB Capability to meet customers High-Tech requirement with High-Density, High Multilayer, Greater Aspect Ratio, better Impedance Controlled product.

Our Rigid PCB Capabilities below:

Item Description Techonical Data
1 Layers 2-48 Layers
2 Max. Board Size 864 x 610 mm (34" x 24")
3 Min. Board Thickness 0.2mm (2 layers) / 0.4mm (4 layers) / 0.9mm(8 layers) / 1.2mm (10 layers) / 1.3mm (12 layers) / 1.5mm (14 layers) / 1.7mm (16 layers) / 1.8mm / 2.0 mm (18 layers) / 2.2mm (20 layers) / 2.4mm ( 22 layers) / 2.6mm (24 layers)
4 Max. Board Thickness 315mil(8mm)
5 Max. Copper Thickness 19oz/Inner Layer: 12oz/Outlayers
6 Min. Inner Line Width / Space 4mil(0.1mm) / 4mil(0.1mm)
7 Min. Outer Line Width / Sapce 4mil(0.1mm) / 3.5mil(0.089mm)
8 Min. Finish Hole Size 6mil(0.15mm)
9 Max. Aspect ratio 12:1
10 Minimum via hole size and pad via: dia. 0.2mm / pad: dia. 0.4mm ; HDI <0.10mm via
11 Minimum hole tolerance ±0.05mm(NPTH), ±0.076mm(PTH)
12 Finished hole size tolerance(PTH) ±2mil(0.05mm)
13 Finished hole size tolerance(NPTH) ±1mil(0.025mm)
14 PTH hole copper thickness mini 25um(1.0mil)
15 Hole Position Deviation ±2mil(0.05mm)
16 Outline Tolerance ±4mil(0.1mm)
17 S/M Pitch 3mil(0.08mm)
18 Insulation Resistance 1 × 1012Ω
19 Thermal Shock 3 × 10Sec@288 ℃
20 Warp and Twist ≤0.5%
21 Peel Strengh 1.4N / mm
22 Solder Mask Abrasion ≥6H
23 Flammability 94V - O
24 Impedance Control ±5%
25 Mini Solder mask Opening 0.05mm(2mil)
26 Mini solder mask coverage 0.05mm(2mil)
27 Mini solder dam 0.076mm(3mil)
28 Surface Finish Treatment Flash gold (Electrolytic);
Electroless nickel Immersion gold (Electroless Ni/Au);
Organic Solderability Preservatives (OSP or Entek), Hot Air Leveling (=HAL-Tin/Lead);
Hot Air Leveling (Lead- Free, RoHS);
Carbon Ink, Peelable Mask, Gold Fingers (30µ"), Immersion Silver (3~10u"), Immersion Tin (0.6~1.2um).
29 G/F Au thickness 0.76um max ( 30u” max )
30 V-cut angle 30° 45° 60° ,tolerence +/- 5°
31 Mini V-cut board thickness 0.8mm
32 V-cut remain thickness tolerance ±0.1mm
33 Profiling mode Routing & Punching
34 Profiling tolerance ±0.1mm(4mil)
35 E-TEST voltage 250 ± 5 V
36 Capacity 60,000 square feet (Month)

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